MICROMESH PRODUCT INFO
Conventional sandpaper is designed to be aggressive so that it will dig deeply. In its manufacture the crystals are electrically charged so that they will stand up. They are locked into a hard resin and when you apply the paper to a surface it will literally tear in and remove the substrate of the material you are sanding. The crystals cut in a negative raking motion, leaving inconsistent scratch patterns.

MicroMesh does the opposite. The backing is long lasting cloth to which an ultra-flexible cushioning layer is applied. On top of this layer we have a very resilient and flexible glue, instead of a hard resin. This allows each crystal to be held in place whilst also allowing it to move and rotate. When you start to apply pressure to sand with Micromesh, the crystals sink into the cushioning layer whilst beginning to cut a bit. If you push harder they will sink further into the cushioning layer, serving as a safety valve. To increase the depth of the cut, simply use a coarser grade of Micromesh. Instead of the deep scratch that sandpaper makes, Micromesh produces a refined scratch that is close to a RMS* of 1.0. The cushioning layer also allows the crystals to cut with a planing motion that leaves an extremely consistent scratch pattern and allows you to achieve extraordinary levels of gloss.

*RMS is the 'Root Mean Square' of a surfaces measured microscopic peaks and valleys.

Where conventional abrasives will take surfaces down 2 or 3 thousandths (.002 or .003), Micro-Mesh® will take it down one ten thousandth (.0001) or less, giving you ultimate and unrivalled control.

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